Teramount

Jerusalem, Israel Semiconductors Acquired

Teramount is an Israel-based silicon photonics packaging company that develops detachable fiber-to-chip connectivity solutions for high-volume co-packaged optics (CPO) and other silicon photonics applications. Its TeraVERSE platform, built on a patented Universal Photonic Coupler and wafer-level self-aligning optics, enables large numbers of single-mode and polarization-maintaining fibers to be coupled to silicon photonics chips using standard semiconductor manufacturing and packaging flows, supporting AI/ML processors, network switches, transceivers and sensors. Founded in 2015 by Hesham Taha and Abraham (Avi) Israel, both Hebrew University applied physics PhDs, the company partners with foundries such as GlobalFoundries and was acquired by Molex in May 2026.

Acquired

Teramount has been acquired

Acquired by Molex (Koch Industries) May 7, 2026 ~$430M (reported)

This company is no longer available on our private secondary market.

Overview

Company data and valuation marks are estimates and may be incomplete, stale, erroneous, or revised.

Founded

2015

Employees

40–60

Total Funding

$58M

2 rounds

Funding

Total raised $58M across 2 rounds

Funding data and valuation marks are estimates and may be incomplete, stale, erroneous, or revised.

Last updated 06-25-2026

Latest Round

Type

Series A

Date

July 2025

Amount

$50M

Valuation

Lead Investors

Koch Disruptive Technologies
DateRoundAmount RaisedValuationLead Investors
July 2025 Series A $50M Koch Disruptive Technologies
2021 Seed $8M Grove Ventures

Leadership

  • Hesham Taha

    Co-Founder & CEO

  • Abraham (Avi) Israel

    Co-Founder & CTO

Competitors

Competitor list is illustrative and may be incomplete, stale, or erroneous.

  • Ayar Labs

    Optical I/O chiplet company developing in-package optical interconnects for AI compute, competing on co-packaged optics adoption.

  • Lightmatter

    Photonic computing and interconnect company building Passage optical fabric for AI clusters; overlaps in silicon photonics packaging for compute fabrics.

  • Celestial AI

    Photonic Fabric optical interconnect platform for AI accelerators; alternative approach to scaling chip-to-chip optical bandwidth.

  • POET Technologies

    Designs and develops the POET Optical Interposer platform for integrating photonic and electronic devices for transceivers and CPO.

  • Lightium

    Israeli silicon photonics startup developing chip-scale optical engines and fiber coupling solutions for data center and AI interconnects.

  • Ranovus

    Develops co-packaged optics and silicon photonic engines for AI and hyperscale data center interconnects.

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